A two-part epoxy resin system features low to moderate viscosity. It is well suited for potting, coating, and sealing electronic assemblies, and excels at bonding dissimilar substrates with different coefficients of expansion. This high-performance adhesive has a service temperature range of -60º to 250ºF. Typical viscosity of Part A is 4000 cps at 25ºC, and for Part B, 10,000 cps at 25ºC. The system produces high-strength castings, bonds, and seals that are remarkably resistant to thermal cycling and shock. Its bond strength is generally greater than 1500 psi, and its tensile strength normally exceeds 1100 psi. The hardened compound is an electrical insulator with a volume resistivity greater than 1012 ohm-cm. EP21FL is available in half-pint, pint, quart, one-gallon and five-gallon container kits.